Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 16A-03
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Joint Reliability of SnAgCu Solder Bumps on Electroless CuNiP
*Yoshimichi Sogawa, Takao Yamazaki, Nobuaki Takahashi
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Keywords: UBM, CuNiP, Joint Reliability, SnAgCu
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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