Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 16A-04
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Effect of ramp rate during temperature cycling test for solder joint reliability(2)
*Takayuki Nagai, Yuichi Aoki, Ichisaku Tsujie
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Keywords: solder, temperature cycling, temperature ramp rate, CSP, fatigue life
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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