Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 16A-06
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Improvement in the speed of Nondestructive inspection for Micro Bump Interconnections using Laser Measurement System
*Yuki Sato, Hideo Miura
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Keywords: Nondestructive inspection, Three dimensionally stacked structure, Thermal deformation, Reliability, Laser measurement
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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