Non-destractive detection of electrical connection failure by using passive intermodulation

Abstract

Non-destructive inspection is strongly demanded for a soldering connection failure such as Pin open. In this report, we propose a method based on passive intermodulation of electromagnetic wave. This is a non-destructive method that the feeding signals as well as resulting intermodulation signal are provided without physical connection. In this report, we present several experimental results on electrical contacts composed of conductive wires which are obtained in 2GHz band, to show the validity of the method. A result on actual soldered sample after heat-cycle test will be also shown.