Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 16A-08
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Bond strength specimen's fabrication process and evaluation for hermetic seal of MEMS package
*Yoshinori Yokoyama, Yoshio Fujii, Hiroshi Fukumoto, Daisuke Katagiri
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Keywords: Anodic bonding, Vacuum Packaging, Bond strength, Stress, MEMS
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Abstract
[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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