Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 16A-09
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Technological Trends of Stress Simulation for Electronics Packaging and Development of High Accuracy Simulation Tool for LSI-Package Warp Deformation
*Ichiro Hirata
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Keywords: Visco-Elastic Simulation, Homogenization Method, Multi-Layered Beam Theory
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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