Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 16A-14
Conference information
Evaluation of Electric Reliability and Analysis of Deterioration Mechanism of Cured Epoxy / NBR Blends
*Daisuke ChibaSachio YoshiharaNaoki Yokoyama
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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