Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 16A-13
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Thermal deformation of BGA packaged circuit boards measured and analysed by laser speckle interferometer and FEM.
*Takashi Ohkoshi, Koji Koibuchi
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Keywords: BGA packaged circuit board, Thermal deformation, Thermal load, Laser speckle interferometer, FEM
CONFERENCE PROCEEDINGS FREE ACCESS

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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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