Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 14A-12
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Assembly reliability of multi-layer FPC "SBic"
*Masayoshi Kondo, Masaaki Kato, Toshiaki Chuma, Toshio Komiyatani, Takahisa Iida, kenichi Kanemasa
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Keywords: Multi-layer, FPC, Bump interconnection, Solder interconnetion
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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