Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 14A-11
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Development of low cost FPCs(No.1)
*Yoshiro MoritaTomoo ImatakiMasashi OgawaRina MurayamaHiroshi Matubarahidemi Nawahune
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
In term of fabricating FPCs in the low cost, Direct Metallization, which method to form a copper layer on a polymide film directly is promising method. The key technology to realizing that is how to change a amic acid layer into a polymide layer on the polymide film again. In this research, it was revealed that the reason was due to the existence of Cu ions in the amic acid layer.
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© 2007 by The Japan Institute of Electronics Packaging
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