Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 14B-08
Conference information
Examination for Enhanced Accuracy of Thermal Simulation about Printed Wiring
*Hiroyuki MotokiKenichi Higashiura
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract
[in Japanese]
Content from these authors
© 2007 by The Japan Institute of Electronics Packaging
Previous article Next article
feedback
Top