Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 14B-10
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Effects of composition material factors and structure on heat transfer characteristics of printed wiring boards
*Masataka Hirokawa, Hideki Mizushina, Satoru Haga, Hideo Takakusagi, Masaru Ishizuka
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Keywords: printed wiring board, copper clad laminate, heat transfer
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Abstract
[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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