Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 14B-11
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High accuracy thermal analysis methodology for semiconductor junction temperatures considering line patterns of multilayered circuit boards
*Yutaka Kumano, Tetsuyoshi Ogura, Toru Yamada
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Keywords: semiconductor device, junction temperature, multilayered circuit board, thermal analysis
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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