Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 14C-08
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Application of electroless CoWP / NiB films to diffusion barrier layer for ULSI interconnection
*Hitoshi Aramaki, Masahiro Yoshino, Toyoto Masuda, Junji Sasano, Kazuyoshi Ueno, Yosi Shacham-Diamand, Tetsuya Osaka
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Keywords: Wet process, ULSI interconnection, Diffusion barrier layer, Self-assembled monolayer
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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