Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 14C-09
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Development of Deep Silicon Trench Etching Technique for Three-Dimensional Integration
*Hirokazu Kikuchi, Yusuke Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
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Keywords: Three-dimensional Integration, Through Si Via, Etching, Trench
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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