Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 18B-11
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Host: Japan Institute of Electronics Packaging

Observation of the microstructural change of Cu wiring with the generation of electro chemical migration and optimization of material system for its improvement
*[in Japanese], [in Japanese], [in Japanese], [in Japanese]
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CONFERENCE PROCEEDINGS FREE ACCESS

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© 2008 by The Japan Institute of Electronics Packaging
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