Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 18B-13
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Host: Japan Institute of Electronics Packaging

thermal analysis on semiconductor pakcages and test boards for various mesh models
*Haruki Sueyoshi, Seiichiro Yoshida, Woon Choi, Hajime Tomokage
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Keywords: thermal analysis
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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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