Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 18B-15
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Host: Japan Institute of Electronics Packaging

Analysis of Thermal deformation behavior of SiP by Heat cycle test
*Nobuhiro Matoba, Aki Suzuki, Ryuichi Sugie, Mototaka Ito, Manabu Oishi
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Keywords: Heat cycle test, Thermal deformation behavior, SiP
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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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