Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 18B-18
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Host: Japan Institute of Electronics Packaging

Study of acceleration of insulation reliability examination
*Wataru Urano, Hironori Ohta, Toshiya Suzuki
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Keywords: HHBT, HAST, insulation reliability
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Abstract
The relation of the result of the insulation reliability test between"HHBT" and "HAST" was investigated with the printed circuit board with THinsulation pattern.We will introduce the case of finding "HAST" results accelerated from"HHBT" results.
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© 2008 by The Japan Institute of Electronics Packaging
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