Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 18C-09
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Host: Japan Institute of Electronics Packaging

Low Thermal Expansion and High Heat Dissipation Printed Wiring Boards
*Sohei Samejima, Tsuyoshi Ozaki, Sadao Sato, Atsushi Inoue, Kentaro Suzuki, Hiroyuki Osuga, Katsuaki Matsui
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Keywords: Carbon Fiber Reinforced Plastic
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Abstract
A new core PWB has been developed by utilizing CFRP (Carbon Fiber Reinforced Plastics) to mount large-scale ceramic packages. We have confirmed that the CFRP core PWB developed show higher heat dissipation and lower thermal expansion than the conventional glass-epoxy and aluminum core PWB.
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© 2008 by The Japan Institute of Electronics Packaging
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