Pd被覆Cuワイヤを用いたワイヤボンディング

小野寺 正徳; 新間 康弘; 目黒 弘一; 田中 淳二; 河西 純一

doi:10.11486/ejisso.22a.0.175.0

The 22th JIEP Annual Meeting

Session ID : 18C-18

DOI https://doi.org/10.11486/ejisso.22a.0.175.0

Conference information

Host: Japan Institute of Electronics Packaging

Wire Bonding Using Pd-Plated Cu Bonding Wire

*Masanori Onodera, Yasuhiro Shinma, Kouichi Meguro, Junji Tanaka, Junichi Kasai

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Keywords: copper, palladium, bonding wire, surface, interface

CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract

The interface after wire bonding process and the change in the surface state of the wire were examined by using EPMA, AES, and XPS for Pd-plated Cu bonding wire. We found that the surface of first ball portion after bonding was coated with Pd, and was advantageous in respect of the oxidation prevention of Cu and stability to the prolonged storage was excellent.

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