Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 19A-06
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Host: Japan Institute of Electronics Packaging

Development of laminate with low dielectric loss materials
*Jun Nunoshige, Satoru Amou, sin horiuchi, Mitsuru Ueda
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Keywords: Thermosetting PPE resin, Multifunctional stylene, Low dielectric loss, Copper clad laminate
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Abstract
[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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