The study of reliability for any layer build-up PWB

Abstract

We have studied the reliability for all layer plated laser via type PWB.This type of PWB consists of glass epoxy as insulation layer, cupper foil as conductor layer and plated cupper as via hole for interconnect layer to layer. We evaluated the reliability of this type of PWB, and found that the thermal stress is concentrated on the inner layer via (IVH) compared with conventional build up type of PWB. Therefore we studied the lower thermal stress structure of all layer plated build up type PWB.