The 22th JIEP Annual Meeting
Session ID : 17A-02
Conference information
Host: Japan Institute of Electronics Packaging
The Evaluation Technology of LSI Conducted Immunity using DPI Method.
*Yukiharu Akiyama, Masahiko Ide, Yoshio Yagi, Eiji Iwasaki, Toshiharu Horie, Junichi Shirai, Tomomi Nishizawa, Atsushi Nakamura, Haruo Shimamoto
Author information
Details
