Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 17B-07
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Host: Japan Institute of Electronics Packaging

Bi-directional optical sub assembly chip using Si microlens
*Daisuke SHIMURA, Ryo Sekikawa, Masahiro Uekawa, Katsumi Aoyama, Hironori Sasaki, Takeshi Takamori, kenji nishide
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Keywords: Silicon microlens, Fiber to the home, micro BOSA
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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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