Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 17B-09
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Packaing stress induced deterioration mechanism of signal quality in an optical modual
*Atsushi KitamuraKen SuzukiHideo Miura
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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