Proceedings of JIEP Annual Meeting
The 23th JIEP Annual Meeting
Session ID : 11A-10
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Host: Japan Institute of Electronics Packaging

The 23th JIEP Annual Meeting
Studies on Through-hole Filling Using PEG Derivatives
*Koji Nakajima, Kentaro Nakamura, Toshiaki Matsubara, Masaharu Sugimoto, Hideo Honma
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Keywords: PEG derivative
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[in Japanese]
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© 2009 The Japan Institute of Electronics Packaging
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