Proceedings of JIEP Annual Meeting
The 23th JIEP Annual Meeting
Session ID : 11B-01
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Host: Japan Institute of Electronics Packaging

The 23th JIEP Annual Meeting
Formation of Seed-Layered Plating with High Adhesion for Various Material
*Genki Kanamori, Shinya Tanaka, Katsuhiko Tashiro, Mitsuhiro Watanabe, Hideo Honma
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Keywords: Seed-layered plating
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[in Japanese]
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© 2009 The Japan Institute of Electronics Packaging
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