Abstract
To achieve both fine-pattern and heat-resistance, we considered the direct electroless palladium/gold plating process on copper substrate. In this results, application of newly-developed pre-coating solution enabled direct electroless palladium/gold plating on copper substrate. Compared a performance of the plating film of this process with (conventional) other surface finishing, we confirmed that this process had excellent performance, which showed the same or better performance of solderability and wire bonding ability than conventional electroless nickel/palladium/gold film.
