Proceedings of JIEP Annual Meeting
The 23th JIEP Annual Meeting
Session ID : 11B-05
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Host: Japan Institute of Electronics Packaging

The 23th JIEP Annual Meeting
Preparation of nano-composite passivation film by printing process at low temperature
*Sei Uemura, Kouji Suemori, Manabu Yoshida, Satoshi Hoshino, Noriyuki Takada, Takehito Kodzasa, Nobuki Ibaraki, Toshihide Kamata
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Keywords: printable passivation film, nano-composite, flexible device, barrier film
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Abstract
Silicon-based Nano-composite film was prepared by wet-process at low temperature. The film was applied to electric device as a passivation film and then evaluated.
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© 2009 The Japan Institute of Electronics Packaging
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