Proceedings of JIEP Annual Meeting
The 23th JIEP Annual Meeting
Session ID : 11B-11
Conference information

Host: Japan Institute of Electronics Packaging

The 23th JIEP Annual Meeting
Room temperature bonding with Ag nanoparticle paste
*Daisuke Wakuda, Keun-Soo Kim, Katsuaki Suganuma
Author information
Keywords: nanoparticle, bonding, room temperature, Ag
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (149K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2009 The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top