Proceedings of JIEP Annual Meeting
The 23th JIEP Annual Meeting
Session ID : 11C-12
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Host: Japan Institute of Electronics Packaging

The 23th JIEP Annual Meeting
Low resistance electro conductive adhesive and the reliability
*Yuuki Momokawa, tomohiro nisiyama, asao murakami, naomi ishiduka, youko nagatsuka, noriji mizumura, senichi igarashi
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© 2009 The Japan Institute of Electronics Packaging
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