Development of Thermal Conductive Thermoplastic Polyimide

Abstract

Nowadays, thermal interface materials(TIM) are necessary for the LED devices and the power devices because the power of these devices are becoming higher and higher. So we developed "Thermal Conductive Thermoplastic Polyimide",which has high thermal conductivity (5.0W/mK), insulation and adhesive ability, to meet these needs. This new material can complete the bonding process less than 1 hour (The long time curing process isn't necessary!). We will present about the other features of this material in detail.