The 24th JIEP Annual Meeting
Session ID : 11C-14
Conference information
Host: Japan Institute of Electronics Packaging
The 24th JIEP Annual Meeting
Evaluation of Junction Structure for Novel Wafer Level Packaging Technology Using Laminating Process
*Yasuyuki Yanase, Mayumi Nakasato, Kouichi Saito, Hajime Kobayashi, Atsunobu Suzuki, Takahiro Fujii, Yoshio Okayama, Ryosuke Usui
Author information
Keywords:
Laminating Process,
Wafer Level Packaging
Details
