Proceedings of JIEP Annual Meeting
The 24th JIEP Annual Meeting
Session ID : 12A-01
Conference information

Host: Japan Institute of Electronics Packaging

The 24th JIEP Annual Meeting
Evaluation of three dimensional thermal deformation during reflow process by using digital image correlation method
*Yasuyuki Takanashi, Kenichi Ikeda, Shunsuke Kanetsuki, Shunji Araki, Shugo Miyake, Kohei Suzuki
Author information
Keywords: digital image correlation method, thermal deformation, reflow process, IGBT, CAE
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (393K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2010 The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top