Proceedings of JIEP Annual Meeting
The 24th JIEP Annual Meeting
Session ID : 12A-01
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The 24th JIEP Annual Meeting
Evaluation of three dimensional thermal deformation during reflow process by using digital image correlation method
*Yasuyuki TakanashiKenichi IkedaShunsuke KanetsukiShunji ArakiShugo MiyakeKohei Suzuki
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CONFERENCE PROCEEDINGS FREE ACCESS

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[in Japanese]
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© 2010 The Japan Institute of Electronics Packaging
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