Proceedings of JIEP Annual Meeting
The 24th JIEP Annual Meeting
Session ID : 12B-06
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Host: Japan Institute of Electronics Packaging

The 24th JIEP Annual Meeting
Development of Bonding Equipment for Surface Activation using Formic Gas
*Hiroyuki Shintani, Masatake Akaike, Tadatomo Suga
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Keywords: formic acid, bonding, low temperature, reduction, Cu
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[in Japanese]
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© 2010 The Japan Institute of Electronics Packaging
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