Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 9B-03
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Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
Practical application of device embedded substrate and future issues
*Katsumi Miyama
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Keywords: Device embedded substrate
CONFERENCE PROCEEDINGS FREE ACCESS

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[in Japanese]
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© 2011 The Japan Institute of Electronics Packaging
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