Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 9B-11
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The 25th JIEP Annual Meeting
Relationship between growth rate of interfacial reaction layer and carbon content in solder/carbon steel system
*takaaki kawamotoAkira YamauchiSatoshi KawakuboAtsushi IrisawaKazuya KurokawaJunichi Tanaka
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Abstract
Reaction behavior of Fe and carbon steels in molten Sn-3.0%Ag-0.5%Cusolder was investigated. The thickness of the reaction layer was foundto increase parabolically with immersion time at 623 and 673 K for Feand 0.2% carbon steel. At 723 K, the thickness was found to increaselinearly with immersion time. The growth of the reaction layer betweensolder and 0.4% and 0.6% carbon steels becomes very slow at 723K withthe progress time. This is attributed to the formation of cementitephase at the interface.
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© 2011 The Japan Institute of Electronics Packaging
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