Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 9B-16
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Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
Thermal fatigue life evaluation for solder joints of DBA substrate used for vehicle power device
*Shiqing Zhao, Qiang Yu, Hiroki Akaeda
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Keywords: DBA, Surface roughness, Power device, Reliability
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[in Japanese]
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© 2011 The Japan Institute of Electronics Packaging
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