Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 9C-17
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Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
Au Cone-Bump by Nanoparticle deposition technology
*Fumito Imura, Xiaojun Liu, Shunsuke Nemoto, Fumiki Kato, Katsuya Kikuchi, Motohiro Suzuki, Hiroshi Nakagawa, Masahiro Aoyagi, Yoshihiro Gomi, Iori Saito, Hiroshi Hasegawa
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Keywords: Cone-bump, Nanoparticle deposition technology, Flip-chip interconnection
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[in Japanese]
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© 2011 The Japan Institute of Electronics Packaging
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