Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 10B-02
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Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
Influence of sintering aids in Ag paste on electroless Ni/Au plating process
*Yuki Tsuno, Yuki Nagao, Yasuhiro Tanabe, Kouitiro Murahasi, Tooru Morimoto
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Keywords: LTCC, Ag paste, electroless Ni/Au plating, low melting glass, chemical resistance
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[in Japanese]
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© 2011 The Japan Institute of Electronics Packaging
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