Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 10B-08
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Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
The effect of stirring and current density on the working mechanism of additives in the plating bath for copper foil.
*Takuya Akiba, Sachio Yoshihara, Mitsuyoshi Matsuda
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Keywords: Copper foil, Additive, Stirring, Current density, Electrodeposition
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[in Japanese]
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© 2011 The Japan Institute of Electronics Packaging
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