Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 8A-10
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Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
PWB Design by using 3-d electromagnetic analysis
*Shinichi Maeda
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Keywords: Design, Electromagnetic Analysis, High frequency signal, PWB
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Abstract
The design of the PWB which is sued for very high frequency signal, it is important to control the characteristics impedance of the etch.It is difficult to match the inpedance of the via and the footprint of the components. I designed the PWB for handle the over 10 GBPS signal by using 3D electromagnetic anasysis.
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© 2011 The Japan Institute of Electronics Packaging
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