Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 10E-03
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Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
Study on Wiring Characteristics for Isostatic Conductive Paste
*Kaoru Hashimoto, Yutaka Akiyama, Kazuo Kohno, Kanji Otsuka, Katsuaki Suganuma, Makoto Takeuchi
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Keywords: Conductive Paste, Pulse rise/fall time, eye pattern, S-parameter
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Abstract
An isostatic conductive paste(ICP)where metal particles/flakes are dispersed in a resin is a viable candidate for printable paste materials.Transmission characteristics at GHz is evaluated by measuring eye-patterns and S-parameters. The results showed that the ICP exhibits better aracteristics than the Cu wiring up to 12 Gbps.The reason for better characteristics is considered to be due to the series capacitance between dispersed Ag flakes.
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© 2011 The Japan Institute of Electronics Packaging
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