The 25th JIEP Annual Meeting
Session ID : 8DP-05
Conference information
Host: Japan Institute of Electronics Packaging
The 25th JIEP Annual Meeting
The investigation about applicability of Fe-MWCNT composite film to lead free solder iron chip
*Jun Watanabe, Norihisa Sekimori, Makoto Miyazaki, Kenji Hatsuzawa, Takashi Uetani, Ikuo Shohji
Author information
Keywords:
lead free solder iron,
composite film
Details
