Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 8C-06
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The 25th JIEP Annual Meeting
Hotspot Reduction of LSI devices using High Thermal Conductivity Multilayer Nanofilms
*Kato FumikiKatsuya KikuchiMasahiro AoyagiTetsuyuki IwashitaHidemichi Fujiwara
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CONFERENCE PROCEEDINGS FREE ACCESS

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[in Japanese]
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© 2011 The Japan Institute of Electronics Packaging
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