Proceedings of JIEP Annual Meeting
The 26th JIEP Annual Meeting
Session ID : 9A-10
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Host: Japan Institute of Electronics Packaging

The 26th JIEP Annual Meeting
Improvement of ductility of Bi-Ag High Temperature Lead-free Solders
*Masayoshi Shimoda, Tomohiro Yamakawa, Kunio Shiokawa, Hiroshi Nishikawa, Tadashi Takemoto
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Keywords: Bi-Ag, Lead-free solder, Mechanical properties, Ductility, Cooling rate
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[in Japanese]
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© 2012 The Japan Institute of Electronics Packaging
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