Proceedings of JIEP Annual Meeting
The 26th JIEP Annual Meeting
Session ID : 9B-01
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Host: Japan Institute of Electronics Packaging

The 26th JIEP Annual Meeting
Pre-processing and post-processing technology of direct copper CO2 laser drilling.
*Hirohisa Ando
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Keywords: direct copper CO2 laser drilling, processing technology
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Abstract
By the increase in a HDI printed circuit board, the demand of direct copper CO2 laser drilling is increasing. I will introduce pre-processing and post-processing technology of the laser process.
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© 2012 The Japan Institute of Electronics Packaging
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