Proceedings of JIEP Annual Meeting
The 26th JIEP Annual Meeting
Session ID : 7A-02
Conference information

Host: Japan Institute of Electronics Packaging

The 26th JIEP Annual Meeting
Verification of 2.5D, 3D electromagnetic simulations for high speed interface package
*Toshiki Iwai, Yoshiyuki Kimura, Yoshihiko Ikemoto, Atsushi Sato, Takeshi Ishitsuka
Author information
Keywords: Package, electromagnetic simulation, Electrical characteristics
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (1209K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2012 The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top