Proceedings of JIEP Annual Meeting
The 26th JIEP Annual Meeting
Session ID : 9D-07
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Host: Japan Institute of Electronics Packaging

The 26th JIEP Annual Meeting
Copper Wire Bondability of the Laser-Sintered Silver Nanoparticle Paste
*Sumihiro Takahashi, Kazuhiko Yamasaki, Mamoru Mita, Katsuhiro Maekawa
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Keywords: Copper Wire Bonding, Laser Sintered
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[in Japanese]
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© 2012 The Japan Institute of Electronics Packaging
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